Title :
E-Beam inspection: best practices for copper logic and foundry fabs
Author :
Henry, Todd ; Price, David William ; Fiordalice, R.
Author_Institution :
Kla-Tencor, San Jose, CA, USA
fDate :
30 Sept.-2 Oct. 2003
Abstract :
Monitoring and eliminating buried electrical defects has become critical for 130 nm Cu devices and below. As a result, electron-beam inspection is being widely adopted for both engineering analysis and production line monitoring. In this paper we describe current implementation of e-beam inspection technology for copper logic and foundry fabs. These best practices are then applied to a hypothetical 20,000 WSPM 300 mm fab, taking into account documented case studies, a bench-marking survey of worldwide e-beam inspection utilization, and new advances in e-beam inspection technology.
Keywords :
SRAM chips; copper; electron beam effects; inspection; voids (solid); 130 nm; 300 mm; Cu; Cu device; bench marking survey; copper device; electrical defect; electron beam inspection; engineering analysis; foundry fab; production line monitoring; Acceleration; Best practices; Copper; Foundries; Inspection; Logic devices; Monitoring; Optical materials; Production; Virtual colonoscopy;
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7894-6
DOI :
10.1109/ISSM.2003.1243311
