A Process for optimizing probe and final test through parameter matching

Most manufacturing facilities use a wafer level test operation to screen die functionality before die are diced and packaged. This process is designed to save the cost of packaging non-functional die. Differences between the probe and final test environment can lead to apparent differences in die performance. This paper describes a method to manage differences between test environments and optimize the overall return of a two pass test flow. Underlying theory is presented along with practical examples and witnessed results.