• DocumentCode
    2266424
  • Title

    Correlations of ceria abrasives characteristics between calcination temperature and polishing performance

  • Author

    Nam-Soo Kim ; Dong-Jun Lee

  • Author_Institution
    Samsung Electron Co. Ltd., Youngin-City, South Korea
  • fYear
    2003
  • fDate
    30 Sept.-2 Oct. 2003
  • Firstpage
    447
  • Lastpage
    450
  • Abstract
    In this work, cerium oxide particles were prepared, which could be used as polishing abrasives in STI CMP with organic additives. According to the calcinations temperature, abrasive size (both primary and secondary size and material removal rate) were changed drastically. Particularly, defects and micro-scratch during CMP process were also changed according to the abrasive characteristics, which had determined powder synthesis step. Finally, we observed optimum calcination temperature in the point of polishing performance.
  • Keywords
    abrasives; additives; calcination; ceramics; cerium compounds; chemical mechanical polishing; powder technology; powders; CMP; CeO2; calcination temperature; ceria abrasives; cerium oxide particles; microscratch; organic additives; polishing performance; powder synthesis; Abrasives; Additives; Calcination; Cerium; Chemicals; Crystallization; Powders; Solids; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2003 IEEE International Symposium on
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7894-6
  • Type

    conf

  • DOI
    10.1109/ISSM.2003.1243323
  • Filename
    1243323