Title :
Correlations of ceria abrasives characteristics between calcination temperature and polishing performance
Author :
Nam-Soo Kim ; Dong-Jun Lee
Author_Institution :
Samsung Electron Co. Ltd., Youngin-City, South Korea
fDate :
30 Sept.-2 Oct. 2003
Abstract :
In this work, cerium oxide particles were prepared, which could be used as polishing abrasives in STI CMP with organic additives. According to the calcinations temperature, abrasive size (both primary and secondary size and material removal rate) were changed drastically. Particularly, defects and micro-scratch during CMP process were also changed according to the abrasive characteristics, which had determined powder synthesis step. Finally, we observed optimum calcination temperature in the point of polishing performance.
Keywords :
abrasives; additives; calcination; ceramics; cerium compounds; chemical mechanical polishing; powder technology; powders; CMP; CeO2; calcination temperature; ceria abrasives; cerium oxide particles; microscratch; organic additives; polishing performance; powder synthesis; Abrasives; Additives; Calcination; Cerium; Chemicals; Crystallization; Powders; Solids; Temperature; Testing;
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7894-6
DOI :
10.1109/ISSM.2003.1243323