DocumentCode :
2266424
Title :
Correlations of ceria abrasives characteristics between calcination temperature and polishing performance
Author :
Nam-Soo Kim ; Dong-Jun Lee
Author_Institution :
Samsung Electron Co. Ltd., Youngin-City, South Korea
fYear :
2003
fDate :
30 Sept.-2 Oct. 2003
Firstpage :
447
Lastpage :
450
Abstract :
In this work, cerium oxide particles were prepared, which could be used as polishing abrasives in STI CMP with organic additives. According to the calcinations temperature, abrasive size (both primary and secondary size and material removal rate) were changed drastically. Particularly, defects and micro-scratch during CMP process were also changed according to the abrasive characteristics, which had determined powder synthesis step. Finally, we observed optimum calcination temperature in the point of polishing performance.
Keywords :
abrasives; additives; calcination; ceramics; cerium compounds; chemical mechanical polishing; powder technology; powders; CMP; CeO2; calcination temperature; ceria abrasives; cerium oxide particles; microscratch; organic additives; polishing performance; powder synthesis; Abrasives; Additives; Calcination; Cerium; Chemicals; Crystallization; Powders; Solids; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
ISSN :
1523-553X
Print_ISBN :
0-7803-7894-6
Type :
conf
DOI :
10.1109/ISSM.2003.1243323
Filename :
1243323
Link To Document :
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