Compatibility of a cryogenic aerosol process on SiLK and porous MSQ

Cryogenic aerosol offers an inert and effective approach to particle removal. In this study, we characterize a nitrogen aerosol process on SiLK^® and porous MSQ. The aerosol process was optimized using silicon nitride particle challenge wafers and shown to be >99% efficient for all bin sizes at 0.09 μm and larger. FTIR and ellipsometry measurements on blanket low k films indicate that the nitrogen aerosol has no adverse effect on the low k properties. Dow SiLK^® Clean 1 test structures were processed and then characterized by SEM. No significant damage or delamination was observed on the low k patterned films.