Title :
Electrical and thermal study of membrane multi-chip module systems
Author :
Cheng, Wheling ; Wong, Simon S.
Author_Institution :
Center for Integrated Syst., Stanford Univ., CA, USA
fDate :
31 Jan-2 Feb 1995
Abstract :
Membrane multi-chip modules (MCMs) have been fabricated to investigate both the electrical design and thermal management of advanced MCM systems. Custom bipolar interface circuits have been interconnected to CMOS VLSI chips, achieving a chip-to-chip delay of 5.6 nsec compared with 7.9 nsec for wire bonded system. Integrated decoupling capacitors and bipolar transistors were utilized to reduce power supply noise across chips by a factor of 3.2. To further decrease the thermal resistance of the systems, water has been used to provide extra heat removal paths. The thermal resistance of the systems has been decreased from 25°C/W to 17°C/W with the sealed water
Keywords :
CMOS integrated circuits; VLSI; application specific integrated circuits; bipolar integrated circuits; integrated circuit noise; membranes; multichip modules; thermal resistance; 5.6 ns; CMOS VLSI chips; bipolar transistors; chip-to-chip delay; custom bipolar interface circuits; electrical design; heat removal; integrated decoupling capacitors; membrane multi-chip module; power supply noise; sealed water; thermal management; thermal resistance; Biomembranes; Bonding; Delay; Integrated circuit interconnections; Power system interconnection; Power system management; Thermal management; Thermal resistance; Very large scale integration; Wire;
Conference_Titel :
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-6970-5
DOI :
10.1109/MCMC.1995.512006
