DocumentCode
2267085
Title
Sensitivity analysis of interconnect networks based on S-parameter macromodel
Author
Sun, Yanhua ; Dai, Wayne Wei-Ming
Author_Institution
Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
fYear
1995
fDate
31 Jan-2 Feb 1995
Firstpage
87
Lastpage
92
Abstract
In this paper a simple and efficient approach for time domain sensitivity analysis is presented. Since moments of the Taylor series of a function are derivatives of the function to frequency, the same technique can be used to compute sensitivities. The basic elements in the linear networks are described by their S-parameters and the first derivatives to parameter variations of the S-parameter; which are expressed as Taylor series. A linear network is reduced to an S-parameter based macromodel together with the driving sources and the nodes of interest. The network transfer functions together with their sensitivities with respect to all the parameter variations can be obtained in one pass during the network reduction process. Since the number of external nodes are much less than the total number of nodes in the network, this method is very efficient The method can be extended to compute the second or higher order sensitivities, which are very difficult, if not impossible, for other known methods. Experimental results show that this method is robust and efficient. This method is very useful for performance optimization, especially when the number of design variables and number of specifications are very large
Keywords
S-parameters; linear network analysis; sensitivity analysis; series (mathematics); time-domain analysis; transfer functions; S-parameter macromodel; Taylor series; design; interconnect networks; linear networks; network reduction; optimization; time domain sensitivity analysis; transfer functions; Computer networks; Design optimization; Integrated circuit interconnections; Poles and zeros; Scattering parameters; Sensitivity analysis; Sun; Taylor series; Transfer functions; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-6970-5
Type
conf
DOI
10.1109/MCMC.1995.512009
Filename
512009
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