DocumentCode
2267143
Title
Avoiding dispersion in distributed RLC lines by shaping
Author
Roychowdhury, Jaijeet S.
Author_Institution
AT&T Bell Labs., Allentown, PA, USA
fYear
1995
fDate
31 Jan-2 Feb 1995
Firstpage
111
Lastpage
116
Abstract
The shaping of RLC lines for delay reduction is investigated. It is shown that inductance can act to diminish dispersion, to the extent of reducing delay to its theoretical time-of-flight minimum even in the presence of substantial loss in the line. Simulations predict significant delay improvement (25%-38%) for long MCM lines propagating high-speed signals
Keywords
delays; inductance; integrated circuit interconnections; multichip modules; delay reduction; distributed RLC lines; high-speed signals; inductance; line shaping; long MCM lines; time-of-flight minimum; Capacitance; Circuits; Delay effects; Delay lines; Distortion measurement; Harmonic distortion; Inductance; Predictive models; Propagation delay; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-6970-5
Type
conf
DOI
10.1109/MCMC.1995.512013
Filename
512013
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