Title :
Design of mixed signal MCM-Ds using silicon circuit boards
Author :
Hodges, Charles R. ; Benson, Donald ; Huey, Kangsen
Author_Institution :
nCHIP Inc., San Jose, CA, USA
fDate :
31 Jan-2 Feb 1995
Abstract :
MCM-D technologies can be used to meet the challenges of designing high performance mixed signal MCMs. Available MCM-D technologies offer special features such as high density wirebonding, high density interconnect, and integral passive components. These features allow designers to optimize key mixed signal performance parameters such as isolation, insertion loss, return loss, and noise. Specific design examples illustrate the impact of a specific silicon circuit board based MCM-D technology on these performance parameters
Keywords :
integrated circuit interconnections; integrated circuit packaging; losses; mixed analogue-digital integrated circuits; multichip modules; high density interconnect; high density wirebonding; insertion loss; integral passive components; isolation; mixed signal MCM-Ds; mixed signal performance parameters; return loss; silicon circuit boards; Crosstalk; Dielectric substrates; Insertion loss; Integrated circuit interconnections; Isolation technology; Printed circuits; RF signals; Resistors; Signal design; Silicon;
Conference_Titel :
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-6970-5
DOI :
10.1109/MCMC.1995.512016
