DocumentCode
2267309
Title
Multilinear Isometric Embedding for visual pattern analysis
Author
Liu, Yan ; Liu, Yang ; Chan, Keith C C
Author_Institution
Dept. of Comput., Hong Kong Polytech. Univ., Kowloon, China
fYear
2009
fDate
Sept. 27 2009-Oct. 4 2009
Firstpage
212
Lastpage
218
Abstract
This paper proposes a novel tensor based dimensionality reduction algorithm called Multilinear Isometric Embedding (MIE) based on a representative manifold learning algorithm Isomap. Unlike Isomap that unfolds input data to the vector form, MIE directly works on more general tensor representation and utilizes iterative strategy to seek the low-dimensional equivalence, which best preserves the global geometry. By avoiding the problems caused by data vectorization, MIE reduces the data analysis difficulty and computational cost. More importantly, MIE keeps the intrinsic tensor structure of the data in low-dimensional representation. Meanwhile, MIE inherits the merits of Isomap, i.e., the ability of uncovering the global geometry of high-dimensional observations. By providing explicit embedding function, MIE makes the embedding of new data points to the low-dimensional space straightforward. Experiments on various datasets validate the effectiveness of proposed method.
Keywords
data reduction; geometry; image processing; learning (artificial intelligence); tensors; Isomap; data analysis; data vectorization; general tensor representation; global geometry; iterative strategy; low-dimensional equivalence; low-dimensional representation; manifold learning; multilinear isometric embedding; tensor based dimensionality reduction; tensor structure; visual pattern analysis; Computational efficiency; Computer vision; Geometry; Independent component analysis; Iterative algorithms; Laplace equations; Linear discriminant analysis; Pattern analysis; Principal component analysis; Tensile stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Vision Workshops (ICCV Workshops), 2009 IEEE 12th International Conference on
Conference_Location
Kyoto
Print_ISBN
978-1-4244-4442-7
Electronic_ISBN
978-1-4244-4441-0
Type
conf
DOI
10.1109/ICCVW.2009.5457696
Filename
5457696
Link To Document