Title :
Micro heat spreader enhanced heat transfer in MCMs
Author :
Shen, David S. ; Mitchell, Robert T. ; Dobranich, Dean ; Adkins, Douglas R. ; Tuck, Melanie R.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fDate :
31 Jan-2 Feb 1995
Abstract :
The peak thermal power generated in microelectronics assemblies has risen from less than 1 W/cm2 in 1980 to greater than 40 W/cm2 today, due primarily to increasing densities at both the IC and packaging levels. We have demonstrated enhanced heat transfer in a prototype Si substrate with a backside micro heat channel structure. Unlike conventional micro heat pipes, these channels are biaxial with a greater capacity for fluid transfer. Thermal modeling and preliminary experiments have shown an equivalent increase in substrate thermal conductivity to over 500 W/m.K, or a four times improvement. Optimization of the structure and alternative liquids will further increase the thermal conductivity of the micro heat channel substrate with the objective being polycrystalline diamond, or about 1200 W/m.K. The crucial design parameters for the micro heat channel system and the thermal characteristics of the system are covered
Keywords :
diamond; heat pipes; heat transfer; multichip modules; silicon; substrates; thermal analysis; thermal conductivity; C; MCMs; Si; Si substrate; backside micro heat channel structure; design parameters; heat spreader enhanced heat transfer; micro heat pipes; micro heat spreader; polycrystalline diamond; substrate thermal conductivity; thermal characteristics; thermal modeling; wick structure; Assembly; Conducting materials; Crystalline materials; Electronic packaging thermal management; Heat sinks; Heat transfer; Pumps; Silicon; Thermal conductivity; Thermal management;
Conference_Titel :
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-6970-5
DOI :
10.1109/MCMC.1995.512025
