• DocumentCode
    2267434
  • Title

    A low-cost MCM design topology-the interconnected mesh power system (IMPS)

  • Author

    Low, Yee L. ; Schaper, Len W. ; Ang, Simon S.

  • Author_Institution
    HiDEC, Arkansas Univ., Fayetteville, AR, USA
  • fYear
    1995
  • fDate
    31 Jan-2 Feb 1995
  • Firstpage
    200
  • Lastpage
    205
  • Abstract
    A low-cost MCM design topology, the Interconnected Mesh Power System (IMPS), that will reduce a conventional four layer structure to only a two-layer structure and thus eliminate more than 50% of the cost has been developed and tested. Since the IMPS has its unique power distribution system and signal transmission environment, important issues on electrical performance such as, power distribution impedance, characteristic impedance, propagation delay, signal loss, and etc. have to be addressed. In this paper, the design and fabrication of the IMPS are first described, followed by the characterization of signal transmission with various power/signal/ground configurations. The power distribution system of the IMPS with decoupling capacitors attached were also compared with that of the solid power and ground planes
  • Keywords
    circuit layout; crosstalk; delays; electric impedance; multichip modules; power supply circuits; characteristic impedance; characterization; decoupling capacitors; electrical performance; fabrication; interconnected mesh power system; low-cost MCM design topology; power distribution impedance; power distribution system; power/signal/ground configurations; propagation delay; signal loss; signal transmission environment; two-layer structure; Costs; Impedance; Performance loss; Power distribution; Power system interconnection; Propagation delay; Propagation losses; Signal design; System testing; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-6970-5
  • Type

    conf

  • DOI
    10.1109/MCMC.1995.512027
  • Filename
    512027