DocumentCode
2267434
Title
A low-cost MCM design topology-the interconnected mesh power system (IMPS)
Author
Low, Yee L. ; Schaper, Len W. ; Ang, Simon S.
Author_Institution
HiDEC, Arkansas Univ., Fayetteville, AR, USA
fYear
1995
fDate
31 Jan-2 Feb 1995
Firstpage
200
Lastpage
205
Abstract
A low-cost MCM design topology, the Interconnected Mesh Power System (IMPS), that will reduce a conventional four layer structure to only a two-layer structure and thus eliminate more than 50% of the cost has been developed and tested. Since the IMPS has its unique power distribution system and signal transmission environment, important issues on electrical performance such as, power distribution impedance, characteristic impedance, propagation delay, signal loss, and etc. have to be addressed. In this paper, the design and fabrication of the IMPS are first described, followed by the characterization of signal transmission with various power/signal/ground configurations. The power distribution system of the IMPS with decoupling capacitors attached were also compared with that of the solid power and ground planes
Keywords
circuit layout; crosstalk; delays; electric impedance; multichip modules; power supply circuits; characteristic impedance; characterization; decoupling capacitors; electrical performance; fabrication; interconnected mesh power system; low-cost MCM design topology; power distribution impedance; power distribution system; power/signal/ground configurations; propagation delay; signal loss; signal transmission environment; two-layer structure; Costs; Impedance; Performance loss; Power distribution; Power system interconnection; Propagation delay; Propagation losses; Signal design; System testing; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-6970-5
Type
conf
DOI
10.1109/MCMC.1995.512027
Filename
512027
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