Title :
Thermal characterisation of vertical multichip modules MCM-V
Author :
Cahill, C. ; Compagno, T. ; Donovan, J. O´ ; Slattery, O. ; Mathuna, C. O´ ; Barrett, J. ; Drouhin, I. ; Val, C. ; Tigneres, J.P. ; Stern, J. ; Ivey, P. ; Masgrangeas, M. ; Coello-Vera, A.
Author_Institution :
Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland
Abstract :
This paper describes the thermal characterisation of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of ICs in a three dimensional cube of plastic moulding compound with the inter-chip electrical connections made on the outside faces of the cube. Steady state and transient thermal results are presented. Thermal measurements were carried out on modules containing eight specially designed package evaluation test chips. Simulation results are shown for two applications manufactured in the MCM-V technology; a 2 W 16 chip 256 MBit DRAM module and a 3 W 9 chip image processing system
Keywords :
automatic testing; integrated circuit packaging; multichip modules; plastic packaging; thermal resistance; transient analysis; 2 W; 3 W; DRAM module; MCM-V; image processing system; inter-chip electrical connections; package evaluation test chips; plastic moulding compound; steady state thermal results; thermal characterisation; three dimensional cube; transient thermal results; vertical multichip modules; Electronic packaging thermal management; Image processing; Multichip modules; Plastics; Power dissipation; Semiconductor device measurement; Testing; Thermal conductivity; Virtual manufacturing; Wire;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1995. SEMI-THERM XI., Eleventh Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-2434-X
DOI :
10.1109/STHERM.1995.512045
