DocumentCode :
2267876
Title :
Semicustom design of ASICs: silicon chips-versus-FPGAs for engineering education
Author :
Abdel-Aty-Zohdy, Hoda S. ; Jozefowicz, Paul A.
Author_Institution :
Dept. of Electr. & Syst. Eng., Oakland Univ., Rochester, MI, USA
fYear :
1993
fDate :
16-18 Aug 1993
Firstpage :
1548
Abstract :
Application Specific Integrated Circuits (ASICs) implementation is a definite move forward in large-scale electronics. ASICs offer better yield, life time, performance, as well as reliability as compared to traditional hybrid circuits. Effective use of Electronics Design Automation Tools (EDAT) is essential for successful ASICs. Also, the use of EDATs is expected to narrow the gap between the academia and industry. Thus, future graduating engineers would make effective contributions to the vastly developing electronics, national and international market. This paper compares the necessary background and the advantages of two alternatives for implementing semicustom design of ASICs; semicustom silicon chips, and Field Programmable Gate Arrays (FPGAs). An 8×8 multiplier design example is used as illustration. The feasibility, accessibility and rewards of such educational experiences are also addressed
Keywords :
application specific integrated circuits; circuit CAD; electronic engineering education; field programmable gate arrays; integrated circuit design; logic CAD; programmable logic arrays; silicon; ASIC design; FPGAs; Si chips; application specific integrated circuits; electronics design automation tools; engineering education; field programmable gate arrays; semicustom design; Application specific integrated circuits; Consumer electronics; Design engineering; Engineering education; Field programmable gate arrays; Laboratories; Large scale integration; Large-scale systems; Reliability engineering; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 1993., Proceedings of the 36th Midwest Symposium on
Conference_Location :
Detroit, MI
Print_ISBN :
0-7803-1760-2
Type :
conf
DOI :
10.1109/MWSCAS.1993.343411
Filename :
343411
Link To Document :
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