• DocumentCode
    2267921
  • Title

    High performance air cooling scheme using ducted microchannel parallel plate-fin heat sinks

  • Author

    Kleiner, Michael B. ; Kuehn, Stefan A. ; Haberger, Karl

  • Author_Institution
    Corp. Res. & Dev., Siemens AG, Munich, Germany
  • fYear
    1995
  • fDate
    7-9 Feb 1995
  • Firstpage
    122
  • Lastpage
    130
  • Abstract
    In this work a high performance air cooling scheme based on microchannel parallel plate-fin heat sinks, in which the coolant is ducted to and optionally from the heat sink through tubes, is theoretically and experimentally investigated. The performance in terms of thermal resistance, pressure drop, and pumping power is modeled as a function of heat sink dimensions, tube dimensions, and air flow rate. Optimizations are performed and design trade-offs discussed. A specimen heat sink with lateral dimensions of 5 cm×5 cm, with 150 μm thick fins, and with 300 μm wide channels was fabricated using copper foils and a simple assembly process. The performance of the heat sink was evaluated experimentally. A thermal resistance of approximately 0.2 K/W is achieved at a pressure drop of 12.5 mbar and an air flow rate of 5 l/s. The agreement between predicted and experimental results is found to be comparatively good. Results of the present study are compared to results of other investigations concerning direct air cooling. The achievable thermal performances using the investigated cooling approach are superior to those attainable using conventional air cooling schemes as well as to those employing silicon microcoolers
  • Keywords
    channel flow; cooling; heat sinks; optimisation; packaging; thermal resistance; air flow rate; assembly process; copper foils; ducted microchannel heat sinks; heat sink dimensions; high performance air cooling scheme; model; parallel plate-fin heat sinks; pressure drop; pumping power; thermal resistance; tube dimensions; Assembly; Coolants; Cooling; Copper; Design optimization; Heat pumps; Heat sinks; Microchannel; Silicon; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1995. SEMI-THERM XI., Eleventh Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-2434-X
  • Type

    conf

  • DOI
    10.1109/STHERM.1995.512061
  • Filename
    512061