• DocumentCode
    2268357
  • Title

    Service and Intellectual/Knowledge Trading E-Business Model

  • Author

    Li-Ming Liu ; Shui Wang ; Zhi-xue Liang

  • Author_Institution
    Software Sch., Nanyang Inst. of Technol., Nanyang
  • Volume
    3
  • fYear
    2008
  • fDate
    20-22 Dec. 2008
  • Firstpage
    185
  • Lastpage
    190
  • Abstract
    Traditional e-business focuses on physical products trading, and although there are transactions of the so called "virtual products", its scope is limited to "downloadable files" or game card points. But in offline market, services & intellectual works forms an important part in all commercial fields. By reconstructing the concept of "intangible product" in e-business context, this paper discusses the definition of service & intellectual/knowledge product, gives a full description on their e-business workflow; and based on the three layered open source J2EE architecture, implements a fully functional intangible product trading platform - IntelServ.com, with which service transactions can by carried out via a variety of models like B2C, C2C, bidding, auction, etc. This system can be deployed on a low cost Linux server, giving the company that hosts this project an economical startup.
  • Keywords
    Java; Web sites; electronic commerce; workflow management software; IntelServ intangible product trading platform; Linux server; e-business workflow model; intellectual product trading; knowledge product trading; service trading; service transaction; three-layered open source J2EE architecture; virtual product trading; Application software; Business; Containers; Context modeling; Context-aware services; Costs; Information technology; Linux; Shape control; Software architecture; e-business platform; intangible product; intellectual/knowledge product; service trading; software architecture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Information Technology Application, 2008. IITA '08. Second International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-0-7695-3497-8
  • Type

    conf

  • DOI
    10.1109/IITA.2008.220
  • Filename
    4739984