Computer-aided trade-off study of an integrated infrared sensor

Author

Korvink, J.G. ; Lenggenhager, R. ; Funk, J. ; Wachutka, G. ; Baltes, H.

Author_Institution

Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland

fYear

1994

fDate

5-6 Jun 1994

Firstpage

173

Lastpage

176

Abstract

We optimise the design and operation of a thermoelectric infrared radiation sensor, using the microsensor simulator SESES. Incoming radiation is in the range of 3W/m², resulting in temperature differences of a few mK. Free convective and radiative cooling are important effects adding to bulk conduction. Our numerical system provides four essential operations required to perform the optimisation: parametrisable device geometry, a graded computational mesh through automatic mesh adaptation, an accurate mesh refinement indicator and a fast linear equation solver

Keywords

CMOS integrated circuits; circuit analysis computing; cooling; digital simulation; electric sensing devices; electronic engineering computing; infrared detectors; integrated circuit design; integrated circuit modelling; mesh generation; natural convection; optimisation; semiconductor device models; simulation; thermal analysis; thermopiles; CMOS type; SESES; Si; automatic mesh adaptation; bulk conduction; computer-aided tradeoff study; convective cooling; design optimisation; graded computational mesh; integrated infrared sensor; linear equation solver; mesh refinement indicator; microsensor simulator; numerical system; parametrisable device geometry; radiative cooling; thermoelectric IR radiation sensor; Computational modeling; Cooling; Design optimization; Infrared sensors; Microsensors; Optical computing; Temperature distribution; Temperature sensors; Thermal sensors; Thermoelectricity;

fLanguage

English

Publisher

ieee

Conference_Titel

Numerical Modeling of Processes and Devices for Integrated Circuits, 1994. NUPAD V., International Workshop on

Conference_Location

Honolulu, HI

Print_ISBN

0-7803-1867-6

Type

conf

DOI

10.1109/NUPAD.1994.343464

Filename

343464