Architecture and implementation of 3D field support in semiconductor wafer representation

Author

Yang, Chung ; Giles, Martin D.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

fYear

1994

fDate

5-6 Jun 1994

Firstpage

81

Lastpage

84

Abstract

This paper describes the design and implementation of a flexible architecture for representing general, mesh-based fields in one, two, and three dimensions. Representation of fields is one component of Semiconductor Wafer Representation (SWR) for TCAD Frameworks. Our architecture allows arbitrary field value types and a variety of element orders to be used based on a minimal description of the underlying mesh geometry. Implementation library components support efficient sharing of objects between clients while preserving full C++ type information. Client-level interfaces to external mesh generation and visualization are demonstrated

Keywords

C language; CAD/CAM; mesh generation; object-oriented methods; semiconductor process modelling; 3D field support; C++ type information; TCAD frameworks; client-level interfaces; element orders; flexible architecture; mesh-based fields; object sharing; object-oriented interface; semiconductor process simulation; semiconductor wafer representation; Computer architecture; Data visualization; Geometry; Graphical user interfaces; Interpolation; Libraries; Mesh generation; Object oriented modeling; Prototypes; Shape;

fLanguage

English

Publisher

ieee

Conference_Titel

Numerical Modeling of Processes and Devices for Integrated Circuits, 1994. NUPAD V., International Workshop on

Conference_Location

Honolulu, HI

Print_ISBN

0-7803-1867-6

Type

conf

DOI

10.1109/NUPAD.1994.343486

Filename

343486