• DocumentCode
    2269479
  • Title

    Field emitter-array development for microwave applications

  • Author

    Spindt ; Holland, C.E. ; Schwoebel, P.R. ; Brodie, Ivor

  • Author_Institution
    SRI Int., Menlo Park, CA, USA
  • fYear
    1995
  • fDate
    5-8 June 1995
  • Firstpage
    133
  • Abstract
    Summary form only given. In order to make microfabricated field-emitters useful for microwave operation it is necessary to maximize the transconductance of the emitter array. The parameters that determine the transconductance are the emitter tip´s work function; the field-enhancement factor at the tip, /spl beta/ (E=/spl beta/V); and the packing density of the emitter array. The work function depends on the tip material and the condition of the tip´s surface resulting from processing and operating environment. Control of these parameters can be rather limited in practical applications. It is shown that the most direct way to increase the transconductance is by increasing the packing density of the emitter array. With emerging lithography techniques it is possible to increase the packing density by about two orders of magnitude over what was available at the start of the microwave development effort. Updated details of how these improvements have been implemented and their impact on cathode performance are presented.
  • Keywords
    arrays; cathodes; microwave tubes; photolithography; vacuum microelectronics; work function; cathode performance; emitter array; field emitter-array; field-enhancement factor; flat-panel display; lithography techniques; microfabricated field-emission arrays; microfabricated field-emitters; microwave applications; microwave operation; packing density; transconductance; work function; Apertures; Cathodes; Fabrication; Field emitter arrays; Flat panel displays; Lithography; Microwave antenna arrays; Microwave technology; Shape; Transconductance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1995. IEEE Conference Record - Abstracts., 1995 IEEE International Conference on
  • Conference_Location
    Madison, WI, USA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-2669-5
  • Type

    conf

  • DOI
    10.1109/PLASMA.1995.531555
  • Filename
    531555