DocumentCode
2270149
Title
Highly integrated three-dimensional MMIC single-chip receiver and transmitter
Author
Toyoda, I. ; Tokumitsu, T. ; Aikawa, M.
Author_Institution
NTT Human Interface Labs., Kanagawa, Japan
Volume
3
fYear
1996
fDate
17-21 June 1996
Firstpage
1209
Abstract
A three-dimensional (3D) MMIC structure with thin polyimide-film layers on wafers significantly increases the integration level of MMICs. We newly developed 9.2-12 GHz receiver and 9.5-14 GHz transmitter chips with 20 dB gain using 3D MMIC technology. The integration levels of these chips are nearly three times as high as those of conventional planar ones.
Keywords
MMIC; microwave receivers; polymer films; radio transmitters; 20 dB; 9.2 to 12 GHz; 9.5 to 14 GHz; integration level; polyimide film; receiver; three-dimensional MMIC single-chip; transmitter; Conductive films; Gain; Low-noise amplifiers; MIM capacitors; MMICs; Mixers; Polyimides; Radio frequency; Radiofrequency amplifiers; Transmitters;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location
San Francisco, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-3246-6
Type
conf
DOI
10.1109/MWSYM.1996.512153
Filename
512153
Link To Document