DocumentCode
2271095
Title
An Optimal Orientation Certainty Level Approach for Fingerprint Quality Estimation
Author
Xie, Shan Juan ; Yang, Ju Cheng ; Yoon, Sook ; Park, Dong Sun
Author_Institution
Dept. of Electron. & Inf. Eng., Chonbuk Nat. Univ., Jeonju
Volume
3
fYear
2008
fDate
20-22 Dec. 2008
Firstpage
722
Lastpage
726
Abstract
Analyzing the quality of fingerprints in advance can be benefit for a fingerprint recognition system to improve its performance. Representative features for the quality assessment of fingerprint images from two existed types of capture devices are different. Orientation certainty level (OCL) is an effective method to extract image orientation feature. However it is not an effective estimation system to cooperate with the extracted features. In this paper, we explore the application of optimization theory, and support vector machine (SVM) in the field of image processing. Our proposed optimal orientation certainty level (OOCL) approach calculates the OCL for each block, extracts features from the optimal OCL system and uses the SVM classifier to determine whether an image should be accepted as an input to the recognition system. Experimental results show that the proposed OOCL method can improve the recognition rate than OCL method.
Keywords
feature extraction; fingerprint identification; image representation; optimisation; support vector machines; SVM; feature extraction; fingerprint image representation; fingerprint quality estimation; fingerprint recognition system; image processing; optimal orientation certainty level approach; optimization theory; support vector machine; Degradation; Feature extraction; Fingerprint recognition; Image databases; Image matching; Information technology; Quality assessment; Spatial databases; Support vector machine classification; Support vector machines; OCL; fingerprint quality estimation; optimalal theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Information Technology Application, 2008. IITA '08. Second International Symposium on
Conference_Location
Shanghai
Print_ISBN
978-0-7695-3497-8
Type
conf
DOI
10.1109/IITA.2008.454
Filename
4740092
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