DocumentCode :
2271095
Title :
An Optimal Orientation Certainty Level Approach for Fingerprint Quality Estimation
Author :
Xie, Shan Juan ; Yang, Ju Cheng ; Yoon, Sook ; Park, Dong Sun
Author_Institution :
Dept. of Electron. & Inf. Eng., Chonbuk Nat. Univ., Jeonju
Volume :
3
fYear :
2008
fDate :
20-22 Dec. 2008
Firstpage :
722
Lastpage :
726
Abstract :
Analyzing the quality of fingerprints in advance can be benefit for a fingerprint recognition system to improve its performance. Representative features for the quality assessment of fingerprint images from two existed types of capture devices are different. Orientation certainty level (OCL) is an effective method to extract image orientation feature. However it is not an effective estimation system to cooperate with the extracted features. In this paper, we explore the application of optimization theory, and support vector machine (SVM) in the field of image processing. Our proposed optimal orientation certainty level (OOCL) approach calculates the OCL for each block, extracts features from the optimal OCL system and uses the SVM classifier to determine whether an image should be accepted as an input to the recognition system. Experimental results show that the proposed OOCL method can improve the recognition rate than OCL method.
Keywords :
feature extraction; fingerprint identification; image representation; optimisation; support vector machines; SVM; feature extraction; fingerprint image representation; fingerprint quality estimation; fingerprint recognition system; image processing; optimal orientation certainty level approach; optimization theory; support vector machine; Degradation; Feature extraction; Fingerprint recognition; Image databases; Image matching; Information technology; Quality assessment; Spatial databases; Support vector machine classification; Support vector machines; OCL; fingerprint quality estimation; optimalal theory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent Information Technology Application, 2008. IITA '08. Second International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
978-0-7695-3497-8
Type :
conf
DOI :
10.1109/IITA.2008.454
Filename :
4740092
Link To Document :
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