Title :
Power semiconductor-driving technology for high power green electronic systems
Author_Institution :
ECPE, Germany
Abstract :
The megatrends of our modern society such as energy efficiency, E-Mobility and SMART Grid is asking for green power electronic solutions.Power semiconductor devices are an enabling technology to meet these requirements. The major electrical improvement of the new generation of power devices is coming from the overall silicon utilization (vertical & horizontal device optimization). The reliability and ruggedness of these new power semiconductors is driven by an advanced chip interfacing and packaging technology. For ultra high efficiency and ultra high power density solutions WB-devices are being developed. However it has to be considered that the application engineer is faced with new challenges of how to manage all the parasitics, thermal management and circuit set up.
Keywords :
elemental semiconductors; environmental factors; power semiconductor devices; semiconductor device packaging; semiconductor device reliability; silicon; E-mobility; Si; WB-devices; advanced chip interfacing technology; advanced chip packaging technology; green power electronic solutions; high-power green electronic systems; power semiconductor devices; silicon utilization; smart grid; thermal management; Abstracts; Consumer electronics; Packaging; Reliability; Silicon; Silicon carbide; Switches;
Conference_Titel :
VLSI Design, Automation, and Test (VLSI-DAT), 2012 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4577-2080-2
DOI :
10.1109/VLSI-DAT.2012.6212586
