• DocumentCode
    2271236
  • Title

    Embedded SRAM ring oscillator for in-situ measurement of NBTI and PBTI degradation in CMOS 6T SRAM array

  • Author

    Tsai, Ming-Chien ; Lin, Yi-Wei ; Yang, Hao-I ; Tu, Ming-Hsien ; Shih, Wei-Chiang ; Lien, Nan-Chun ; Lee, Kuen-Di ; Jou, Shyh-Jye ; Chuang, Ching-Te ; Hwang, Wei

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2012
  • fDate
    23-25 April 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    One of the major reliability concerns in nano-scale CMOS VLSI design is the time-dependent Bias Temperature Instability (BTI) degradation. Negative Bias Temperature Instability and Positive Bias Temperature Instability (NBTI and PBTI) weaken MOSFETs over usage/stress time. We present an embedded 6T SRAM ring oscillator structure which provides in-situ measurement/characterization capability of cell transistor degradation induced by bias temperature instability. The viability of the embedded ring oscillator odometer and the impact of bias temperature instability are demonstrated in 55nm standard performance CMOS technology.
  • Keywords
    CMOS memory circuits; MOSFET; SRAM chips; VLSI; integrated circuit design; integrated circuit reliability; nanoelectronics; oscillators; CMOS 6T SRAM array; MOSFET; NBTI degradation; PBTI degradation; cell transistor degradation; characterization capability; embedded SRAM ring oscillator structure; embedded ring oscillator odometer; in-situ measurement; nanoscale CMOS VLSI design; negative bias temperature instability; positive bias temperature instability; reliability concerns; size 55 nm; standard performance CMOS technology; time-dependent bias temperature instability degradation; usage-stress time; Arrays; Degradation; Frequency measurement; Random access memory; Reliability; Ring oscillators; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation, and Test (VLSI-DAT), 2012 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    PENDING
  • Print_ISBN
    978-1-4577-2080-2
  • Type

    conf

  • DOI
    10.1109/VLSI-DAT.2012.6212587
  • Filename
    6212587