Analysis of planar circuits with a combined 3D FDTD-time domain modal expansion method

Author

Alimenti, F. ; Mezzanotte, P. ; Roselli, L. ; Sorrentino, R.

Author_Institution

Istituto di Elettronica, Perugia Univ., Italy

Volume

3

fYear

1996

fDate

17-21 June 1996

Firstpage

1471

Abstract

A method combining the conventional 3D FDTD algorithm with the time domain modal expansion has been applied to the analysis of planar circuits enclosed within metallic packages. This method allows for the reduction of the 3D FDTD computational domain to a restricted region close to the planar circuit. This technique has been applied to two different structures: a microstrip and a CPW discontinuity. The results show a significant improvement of the computational efficiency without any appreciable degradation of the accuracy.

Keywords

coplanar waveguides; finite difference time-domain analysis; microstrip circuits; microstrip discontinuities; packaging; 3D FDTD-time domain modal expansion method; CPW discontinuity; computational efficiency; metallic packages; microstrip discontinuity; planar circuit analysis; restricted region; Circuit analysis; Computational efficiency; Coplanar waveguides; Degradation; Electromagnetic waveguides; Finite difference methods; Microstrip; Packaging; Planar waveguides; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1996., IEEE MTT-S International

Conference_Location

San Francisco, CA, USA

ISSN

0149-645X

Print_ISBN

0-7803-3246-6

Type

conf

DOI

10.1109/MWSYM.1996.512214

Filename

512214