Title : 
New design on 2×VDD-tolerant power-rail ESD clamp circuit with low standby leakage in 65nm CMOS process
         
        
            Author : 
Chih-Ting Yeh ; Ming-Dou Ker
         
        
            Author_Institution : 
Inf. & Commun. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
         
        
        
        
        
        
            Abstract : 
A 2×VDD-tolerant power-rail electrostatic discharge (ESD) clamp circuit with only thin gate oxide 1V devices and silicon-controlled rectifier (SCR) as main ESD clamp device has been proposed and verified in a 65nm CMOS process. The proposed power-rail ESD clamp circuit has an ultra-low standby leakage current by reducing the voltage drop across the gate oxide of the devices in the ESD detection circuit. From the measured results, the proposed design with SCR dimension of 50μm in width can achieve 6.5kV human-body-model (HBM), 300V machine-model (MM) ESD levels, and an ultra-low standby leakage current of 34.1nA at room temperature under the normal circuit operating condition with 1.8V bias.
         
        
            Keywords : 
CMOS integrated circuits; electric potential; electrostatic discharge; leakage currents; rectifiers; rectifying circuits; CMOS process; ESD clamp device; ESD detection circuit; HBM; MM ESD level; SCR; VDD-tolerant power-rail electrostatic discharge clamp circuit; current 34.1 nA; human-body-model; machine-model; power-rail ESD clamp circuit; silicon-controlled rectifier; size 50 mum; size 65 nm; temperature 293 K to 298 K; thin gate oxide; ultra-low standby leakage current; voltage 1 V; voltage 1.8 V; voltage 300 V; voltage 6.5 kV; voltage drop; CMOS integrated circuits; CMOS technology; Clamps; Electrostatic discharges; Leakage current; Logic gates; Thyristors;
         
        
        
        
            Conference_Titel : 
VLSI Design, Automation, and Test (VLSI-DAT), 2012 International Symposium on
         
        
            Conference_Location : 
Hsinchu
         
        
        
            Print_ISBN : 
978-1-4577-2080-2
         
        
        
            DOI : 
10.1109/VLSI-DAT.2012.6212606