Title :
Multi-chip receive module for a wide-band X-band dual-beam phased array communication antenna
Author :
Kopp, B.A. ; Axness, T.A.
Author_Institution :
Appl. Phys. Lab., Johns Hopkins Univ., Baltimore, MD, USA
Abstract :
A wide-bandwidth X-band receive module has been developed to support a phased array communication antenna with dual-beam operation. The module utilizes four GaAs MMICs, a single low-temperature-cofired-ceramic (LTCC) substrate, blind-mate connectors, and a custom miniature DC/control 8-pin connector to address the electrical and packaging requirements. A typical module exhibited 3.5 dB noise figure, 23 dB of gain, 0.5 dB RMS amplitude error, and 7/spl deg/ RMS phase error from 7.0-10.0 GHz.
Keywords :
MMIC; antenna accessories; antenna phased arrays; microwave antenna arrays; microwave receivers; multibeam antennas; multichip modules; 23 dB; 3.5 dB; 7 to 10 GHz; GaAs; GaAs MMICs; LTCC substrate; MCM; X-band; blind-mate connectors; dual-beam phased array; low-temperature-cofired-ceramic substrate; multichip receive module; packaging; wideband communication antenna; Antenna arrays; Communication system control; Connectors; Gallium arsenide; MMICs; Noise figure; Packaging; Phased arrays; Receiving antennas; Wideband;
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3246-6
DOI :
10.1109/MWSYM.1996.512243
