DocumentCode :
2272438
Title :
Effects of dopants on wettability and microstructure evolution of Lead-Free solder joints
Author :
Chen, Qiang ; Li, Guoyuan
Author_Institution :
Sch. of Electron. & Inf. Eng., South China Univ. of Technol., Guangzhou, China
fYear :
2010
fDate :
16-19 Aug. 2010
Firstpage :
314
Lastpage :
318
Abstract :
In this study, the synergy effects of Sb and rare earth (RE) element addition on the wettability and microstructure evolution of Lead-Free solder joints are investigated. Experiment results indicate that Sb and RE element possibly had synergy effect on improving the wettability of lead-free solder. It is found that Sn-3.0Ag-0.5Cu-0.8Sb-XY, with X ranging between 0.05 and 0.1, has the best wettability on Cu substrate. The thickness of IMC increases as the amount of yttrium increase from 0wt% to 0.25wt% in the SAC-0.8Sb-Xwt%Y/Cu system.When the yttrium concentration is increased from 0.25wt% to 0.5wt%, the IMC thickness decreases. Further increase in the RE concentration just results in a slightly increasement of the IMC thickness. Considering the wettability and IMC growth, it is found that the optimal composition of the Y is about 0.5wt%. Results in this study just reveal that simutenuasly adding 0.8wt% of Sb and some Y does not have obvious effect on suppression of the IMC growth of the SAC-0.8Sb-Xwt%Y/Cu solder joints.
Keywords :
rare earth metals; solders; wetting; dopants effects; lead-free solder joints; microstructure evolution; rare earth element; synergy effects; wettability; Copper; Lead; Microstructure; Soldering; Substrates; Yttrium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
Type :
conf
DOI :
10.1109/ICEPT.2010.5582338
Filename :
5582338
Link To Document :
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