Title :
Characterisation of RF-IC packages by multiport excitation
Author :
Kollipara, R.T. ; Williams, J. ; Tripathi, V.K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
A new measurement technique based on multiport TDR excitation is presented. The technique is quite accurate and is used to characterize low-cost and small lead frame plastic packages. The extracted self and mutual inductance and capacitance values of a typical package are presented.
Keywords :
capacitance measurement; inductance measurement; integrated circuit measurement; integrated circuit packaging; multiport networks; plastic packaging; time-domain reflectometry; RF-IC package; capacitance; lead frame plastic package; measurement technique; multiport TDR excitation; mutual inductance; self inductance; Admittance; Capacitance; Circuits; Couplings; Fixtures; Impedance; Packaging; Pins; Radio frequency; Transmission line measurements;
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3246-6
DOI :
10.1109/MWSYM.1996.512275
