• DocumentCode
    2272991
  • Title

    Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation

  • Author

    Wu, Sung-Mao ; Guan, Sheng-Wei ; Kuo, Chun-Ting ; Yu, Bo-Huei ; Liu, Chuan- Hau ; Chiou, Xian-Neng

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Kaohsiung, Kaohsiung, Taiwan
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    61
  • Lastpage
    64
  • Abstract
    In this study, a novel impedance match-able structure of QFP (Quad Flat Package) socket contactor is presented. Application property and design formulas of impedance matching varying contactor section length are focus in this paper. Besides, through the use of a transmission line with single-stub tuning theorem and modulating the length of transmission line, novel QFP (Quad Flat Package) socket contactor could achieve impedance matching between DUT and test board. To verify used-method is feasible, RF characterizations are simulated and compared by 3D-EM Solver, Ansoft HFSS, and circuit simulation software, Agilent ADS. According simulation results, each ports of this novel QFN socket contactor are impedance matching up to 20 GHz bandwidth because the return loss is very smaller than -20 dB and insertion loss approximate 0 dB. Another, according to the design formulas derivate in this paper, designer can estimate the effect of contacts which may influence the design before earlier design stage.
  • Keywords
    contactors; electric connectors; electronics packaging; impedance matching; transmission line theory; 3D electromagnetic simulation; 3D-EM solver; Agilent ADS; Ansoft HFSS; DUT; QFP socket contactor; circuit simulation software; impedance matching structure; insertion loss; quad flat package socket contactor; single-stub tuning theorem; test board; transmission line; transmission line length modulation; Contacts; Electronics packaging; Impedance; Integrated circuits; Power transmission lines; Sockets; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5582366
  • Filename
    5582366