DocumentCode
2272991
Title
Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation
Author
Wu, Sung-Mao ; Guan, Sheng-Wei ; Kuo, Chun-Ting ; Yu, Bo-Huei ; Liu, Chuan- Hau ; Chiou, Xian-Neng
Author_Institution
Dept. of Electr. Eng., Univ. of Kaohsiung, Kaohsiung, Taiwan
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
61
Lastpage
64
Abstract
In this study, a novel impedance match-able structure of QFP (Quad Flat Package) socket contactor is presented. Application property and design formulas of impedance matching varying contactor section length are focus in this paper. Besides, through the use of a transmission line with single-stub tuning theorem and modulating the length of transmission line, novel QFP (Quad Flat Package) socket contactor could achieve impedance matching between DUT and test board. To verify used-method is feasible, RF characterizations are simulated and compared by 3D-EM Solver, Ansoft HFSS, and circuit simulation software, Agilent ADS. According simulation results, each ports of this novel QFN socket contactor are impedance matching up to 20 GHz bandwidth because the return loss is very smaller than -20 dB and insertion loss approximate 0 dB. Another, according to the design formulas derivate in this paper, designer can estimate the effect of contacts which may influence the design before earlier design stage.
Keywords
contactors; electric connectors; electronics packaging; impedance matching; transmission line theory; 3D electromagnetic simulation; 3D-EM solver; Agilent ADS; Ansoft HFSS; DUT; QFP socket contactor; circuit simulation software; impedance matching structure; insertion loss; quad flat package socket contactor; single-stub tuning theorem; test board; transmission line; transmission line length modulation; Contacts; Electronics packaging; Impedance; Integrated circuits; Power transmission lines; Sockets; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582366
Filename
5582366
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