Title :
Effect of package shape on spurious coupling among microstrip discontinuities
Author :
Cebi, H. ; Gupta, K.C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
Abstract :
Effects of a metallic package on the performance of a microstrip circuit are attributed mainly to the modifications of spurious couplings among various discontinuities. This paper describes a method for computing the effect of the package shape on the interactions among discontinuities. It is shown that chamfering of the corners of a rectangular package can reduce the spurious coupling between two microstrip open-end stubs.
Keywords :
microstrip circuits; microstrip discontinuities; packaging; corner chamfering; discontinuities; metallic package shape; microstrip circuit; open-end stubs; rectangular package; spurious coupling; Coupling circuits; Current distribution; Finite difference methods; Magnetic circuits; Magnetic separation; Microstrip; Microwave circuits; Packaging; Shape; Time domain analysis;
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3246-6
DOI :
10.1109/MWSYM.1996.512299
