The anti-pyramid distribution in SIP using LTCC technology

Author

Liu, Yingli ; Li, Yuanxun ; Xie, Yunsong ; Zhang, Huaiwu ; Chen, Daming ; Li, Jie

Author_Institution

State Key Lab. of Electron. Thin Film & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

16

Lastpage

18

Abstract

The anti-pyramid stacked chips distribution that can be applied in SIP is reported to have a much better thermal performance comparing to the widely used pyramid distribution. When the package of system is using PCB and LTCC condition, the highest temperature is brought down from 440°K to 417°K and from 326°K to 319°K respectively. In addition, it is also analyzed that the anti-pyramid distribution makes the LTCC packaged system not only has better thermal performance, but also be more reliable. So it is strongly suggested that when the SIP encounter some serious thermal problem, both anti-pyramid stacked chips and LTCC technology should be applied to overcome this problem.

Keywords

ceramic packaging; reliability; system-in-package; LTCC technology; anti-pyramid stacked chips distribution; system-in-package; temperature 319 K to 326 K; temperature 417 K to 440 K; thermal performance; Electronic packaging thermal management; Electronics packaging; Heating; Substrates; System-on-a-chip; Temperature distribution; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582381

Filename

5582381