2.0mils au wire wedge bonding process characterization to eliminate lift bond on accelerometer device

Au wire thermosonic wedge bonding is applied for die to die interconnect on accelerometer device as traditional Al thermo-compression wedge bonding is not suitable for this application due to the constraint of fine pitch silicon bond pad and fragile bond pad structure of MEMS devices. With thermosonic wedge bonding, a few of lifted (wedge) bonds were reported during end customer application, the lifted bond causes malfunction of the device. The methods employed during wedge bond failure study provide an effective and systematic approach on root cause exploration, the characterized wedge bond process effectively eliminates wedge bond lift bond incident and guarantees the smoothness and health of mass production.