Title :
Thermally induced packaging effect of a distributed MEMS phase shifter
Author :
Zhao, Cheng ; Song, Jing ; Huang, Qing-An
Author_Institution :
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
Abstract :
Since radio-frequency microelectromechanial devices work mechanically, they are sensitive to thermally induced packaging effects. These effects will have impacts on their microwave performances and reliability. In this paper, the possible effect of the thermal stress and strain induced in die attaches process on the microwave characteristics of packaged distributed MEMS phase shifters is studied. Theoretical models are established, and full wave electromagnetic simulations are involved. Results show that the thermally induced packaging effect has considerable impact on the phase shift performance of the device.
Keywords :
electronics packaging; microassembling; micromechanical devices; microwave devices; phase shifters; thermal management (packaging); thermal stresses; die attach process; distributed MEMS phase shifter; radio frequency microelectromechanial devices; strain induced; thermal stress; thermally induced packaging effect; Bridge circuits; Electronic packaging thermal management; Micromechanical devices; Packaging; Phase shifters; Strain; Stress;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582394
