Miniaturized receiver front-end hybrid ICs for mobile communication equipment using flip-chip bonding technology

Two types of miniaturized and low power consumption receiver front-end hybrid ICs have been developed. These HICs employed flip-chip bonding technology for miniaturization. The HIC for 800 MHz showed conversion gain of 27 dB and noise figure of 3.3 dB at Vdd=2.7 V and dissipation current of 4.5 mA in 8 mm/spl times/6 mm/spl times/1.2 mm size. The HIC for 1.9 GHz also showed conversion gain of 20 dB and noise figure of 3.7 dB at Vdd=2.7 V and dissipation current of 6.5 mA in 5.7 mm/spl times/5.7 mm/spl times/1.2 mm size.