DocumentCode
2273743
Title
An evaluation of the osteoinductive properties of bioactive composites
Author
Patlolla, Ajitha ; Arinzeh, Treena Livingston
Author_Institution
Dept. of Biomed. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
fYear
2010
fDate
26-28 March 2010
Firstpage
1
Lastpage
2
Abstract
The two most widely investigated materials for bone repair are Ã-tricalcium phosphate (Ã-TCP) (Ca3(PO4)2) and synthetic hydroxyapatite (HA) (Ca10(PO4)6(OH)2). They are bioactive as well as biocompatible and osteoconductive. These materials are categorized as bioactive because they have the ability to form strong chemical bond with the neighboring bone tissue. Clinically, however, these materials have had limited use because of their brittleness and difficulty in shaping. Therefore, biodegradable polymer/bioceramic composites have been sought as an alternative form to using calcium phosphates alone. In this study, composites consisting of 20/80 HA/TCP and poly (¿-caprolactone) (PCL) were fabricated using the electrospinning technique. Electrospun ceramic composites were fabricated with two different architectures and evaluated for bioactivity and osteogenic properties. The results suggested that composites consisting of both nano and mirconscale fiber morphologies had better bioactivity and osteogenic properties.
Keywords
bioceramics; bone; calcium compounds; composite materials; electrospinning; nanobiotechnology; polymers; Ca10(PO4)6(OH)2; Ca3(PO4)2; bioactive composites; biocompatibility; biodegradable polymer-bioceramic composites; bone repair; bone tissue; calcium phosphates; electrospinning technique; electrospun ceramic composites; microscale fiber morphology; nanoscale fiber morphology; osteoconductivity; osteogenic property; osteoinductive property; poly(¿-caprolactone); synthetic hydroxyapatite; Ã\x9f-tricalcium phosphate; Bioceramics; Biodegradable materials; Biological materials; Bonding; Bone tissue; Calcium; Ceramics; Chemicals; Morphology; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Bioengineering Conference, Proceedings of the 2010 IEEE 36th Annual Northeast
Conference_Location
New York, NY
Print_ISBN
978-1-4244-6879-9
Type
conf
DOI
10.1109/NEBC.2010.5458204
Filename
5458204
Link To Document