Title :
Measurement of stray capacitance due to solder flux residue on radio frequency circuit boards
Author :
Heutmaker, M.S. ; Fletcher, L.M. ; Sohn, J.E.
Author_Institution :
AT&T Bell Labs., Princeton, NJ, USA
Abstract :
A microstrip directional coupler is used as a test circuit to measure the stray capacitance due to solder flux residue at frequencies up to 4.8 GHz. Comparison of experimental data with simulation results and coupled line theory provides an estimate of 25/spl plusmn/15 femtofarads for the stray capacitance from one flux residue. This measurement technique may be used to experimentally compare the RF effects of different solder fluxes. When combined with information about conductor spacings, residue properties, and the amount of residue, this measurement could validate estimates of the stray capacitance due to flux residue in a variety of circuit geometries.
Keywords :
capacitance measurement; microstrip directional couplers; printed circuit testing; production testing; soldering; 25 fF; 4.8 GHz; circuit geometries; conductor spacings; coupled line theory; microstrip directional coupler; radio frequency circuit boards; residue properties; solder flux residue; stray capacitance; test circuit; Capacitance measurement; Circuit simulation; Circuit testing; Coupling circuits; Directional couplers; Estimation theory; Frequency measurement; Measurement techniques; Microstrip; Radio frequency;
Conference_Titel :
Technologies for Wireless Applications Digest, 1995., MTT-S Symposium on
Conference_Location :
Vancouver, BC, Canada
Print_ISBN :
0-7803-1982-6
DOI :
10.1109/MTTTWA.1995.512334
