• DocumentCode
    2274050
  • Title

    A transfer function-based thermal model reduction study for induction machine thermal overload protective relays

  • Author

    Zhang, Pinjia ; Du, Yi ; Habetler, Thomas G.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2009
  • fDate
    20-24 Sept. 2009
  • Firstpage
    2313
  • Lastpage
    2320
  • Abstract
    High-order induction machine thermal models have been widely studied for the analysis of the thermal behavior of induction machines. However, the real-time implementation of such models for the online thermal protection of induction machines is very difficult due to the lack of accurate information on the machines. This paper proposes a novel simplified thermal model of induction machines for thermal overload relays. Instead of using a lumped thermal network, a transfer function-based approach is proposed for reducing the order of induction machine thermal models. The proposed thermal model requires significantly fewer thermal parameters for accurate modeling of the thermal behavior of the machine. The proposed thermal model is validated via experimental results on a 7.5-hp ODP (open drip proof) induction machine under various load conditions. The major features of the proposed thermal model are: 1) high accuracy of the stator winding temperature estimation, with an rms (root mean square) error within 2degC; 2) low computational requirement, which reduces the cost of thermal overload relays; and 3) easy implementation, since only current sensors are required.
  • Keywords
    asynchronous machines; relay protection; transfer function matrices; induction machine thermal overload protective relays; open drip proof; transfer function-based thermal model reduction study; Induction machine; model reduction; protective relay; thermal model; thermal protection; transfer function;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2893-9
  • Electronic_ISBN
    978-1-4244-2893-9
  • Type

    conf

  • DOI
    10.1109/ECCE.2009.5316084
  • Filename
    5316084