Automatic layout optimization of a double sided power module regarding Thermal and EMC constraints

This paper presents an automatic layout process for power electronics integrated modules. The chip position and power layout is automatically generated according to the best EMC/thermal trade off. Optimization techniques use simple but fairly accurate EMC and thermal models, presented in this paper. The proposed method is illustrated on a 4 legs 2 kW inverter used for aircraft applications. The realization will use double sided technology.