Title :
Dielectric composite material with enhanced thermal conductivity used for electronic packaging
Author :
Yu, Hui ; Li, Liangliang ; Kido, Teruo ; Xi, Guannan
Author_Institution :
Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
Abstract :
The current trend in the integration and miniaturization of high-power electronic components requires a dielectric material with high thermal conductivity, which can conduct fast heat dissipation to prevent the circuit and substrate from overheating. Adding ceramic powders with a high thermal conductivity into the polymer is an effective way to enhance the thermal conductivity of the dielectric material. In our research, Halogen-free bisphenol-A epoxy and aluminum nitride (AlN) were chosen as the matrix and filler, respectively. The impact of AlN content on the thermal and insulating properties of the composites were investigated. A high thermal conductivity of 2.10 W/(m·K) was achieved with an AlN content of 55.9 % and a dielectric strength of 10-11 kV/mm was obtained. The viscosity of pre-curing suspension was also measured and the experimental data showed that the viscosity dramatically increased at an AlN content of 40%.
Keywords :
aluminium compounds; composite materials; dielectric materials; electric strength; electronics packaging; thermal conductivity; viscosity; AlN; aluminum nitride; ceramic powders; dielectric composite material; dielectric strength; electronic packaging; enhanced thermal conductivity; halogen-free bisphenol-A epoxy; heat dissipation; high-power electronic components; insulating property; polymer; precuring suspension viscosity; thermal conductivity; thermal property; Conductivity; Electronic packaging thermal management; Loading; Suspensions; Temperature measurement; Thermal conductivity; Viscosity; aluminum nitride; composite; dielectric material; thermal conductivity; thin film;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582424