• DocumentCode
    2274470
  • Title

    Characterization and modeling of 1.2 kv, 20 A SiC MOSFETs

  • Author

    Chen, Zheng ; Boroyevich, Dushan ; Burgos, Rolando ; Wang, Fred

  • Author_Institution
    Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
  • fYear
    2009
  • fDate
    20-24 Sept. 2009
  • Firstpage
    1480
  • Lastpage
    1487
  • Abstract
    This paper presents a generic and complete process to characterize and model the newly developed silicon carbide (SiC) MOSFET. The static characteristics, including MOSFET I-V curves, body diode, nonlinear junction capacitances, as well as package stray inductances, have been fully characterized on a prototype 1.2 kV, 20 A SiC MOSFET under varying temperature from 25degC to 200degC. Characteristics particular to the SiC MOSFET and its advantages over the silicon counterparts are analyzed and explained. The switching performance of the device, on the other hand, has also been tested under room temperature using a specially designed double-pulse tester with minimized circuit parasitics. The characterization results are then used to build a SiC MOSFET model using the MOSFET modeling tool in Synopsys Saber. Finally, discussions are presented on how to improve the model accuracy in its switching behavior by obtaining static characteristics from switching waveforms.
  • Keywords
    MOSFET; capacitance measurement; diodes; inductance measurement; semiconductor device models; silicon compounds; switching circuits; I-V curves; MOSFET modeling tool; SiC; Synopsys Saber modeling tool; body diode; current 20 A; device switching performance; double-pulse tester; minimized circuit parasitics; nonlinear junction capacitances; package stray inductances; silicon carbide MOSFETs; static characteristics; switching waveforms; temperature 25 degC to 200 degC; temperature 293 K to 298 K; voltage 1.2 kV; Silicon carbide; modeling; power MOSFET;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2893-9
  • Electronic_ISBN
    978-1-4244-2893-9
  • Type

    conf

  • DOI
    10.1109/ECCE.2009.5316106
  • Filename
    5316106