DocumentCode
2274730
Title
Site-specific and high-spatial-resolution scanning spreading resistance microscopy (SSRM) and its applications to Si devices
Author
Li Zhang
Author_Institution
Adv. LSI Technol. Lab., Toshiba Corp., Kawasaki, Japan
fYear
2012
fDate
14-15 May 2012
Firstpage
89
Lastpage
93
Abstract
In this study, we review on SSRM studies on 2D carrier profiles of various devices applications including S/D engineering and failure analysis in real SRAM devices. The correlation of SSRM images with junction leakage current of nMOSs was confirmed. We also directly observed carbon (C) co-doped Si:C nMOSs, clarifying the C doping effect on phosphorous diffusion and therefore on device characteristics. With utilizing the site-specific SSRM, we succeeded in observing the pn-junction boundary within a thin SRAM poly-Si gate with the size of less than 60 nm. We also directly observed fail bits of pMOSs with Vth variations in SRAM, clarified that the failure is originated from the phosphorus anomalous diffusion into the pMOS gate bottom. Site-specific SSRM is demonstrated having high potential for failure analysis and for characterization of further scaled devices.
Keywords
SRAM chips; carbon; failure analysis; silicon; SRAM devices; SSRM images; failure analysis; high-spatial-resolution SSRM; high-spatial-resolution scanning spreading resistance microscopy; nMOS; pMOS gate bottom; phosphorus anomalous diffusion; pn-junction boundary; site-specific SSRM; site-specific scanning spreading resistance microscopy; thin SRAM poly-gate; Abstracts; Annealing; Junctions; Logic gates; MOS devices; MOSFET circuits; Resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology (IWJT), 2012 12th International Workshop on
Conference_Location
Shanghai
Print_ISBN
978-1-4673-1258-5
Electronic_ISBN
978-1-4673-1256-1
Type
conf
DOI
10.1109/IWJT.2012.6212817
Filename
6212817
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