Title :
Creep behavior investigation of lead-free solder alloy Sn96.5Ag3Cu0.5
Author :
Zhu, Fulong ; Song, Shao ; Zhang, Wei ; Liu, Sheng
Author_Institution :
Inst. of Microsyst., HuaZhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
The creep properties of the lead-free solder alloy Sn96.5Ag3Cu0.5 were investigated and compared with those of the typical Pb-containing solder Sn63Pb37. Creep tests of this lead-free solder Sn96.5Ag3Cu0.5 and Pb-containing solder Sn63Pb37 under different temperature environment of 25°C, 125°C were conducted at different constant stress levels and a series of consistent and reliable creep data were obtained. It could be found that circumstance temperature was the key part of affecting the creep properties of two solder alloys Sn96.5Ag3Cu0.5 and Sn63Pb37. The lead-free solder alloy Sn96.5Ag3Cu0.5 showed good creep resistance and deformation resistance; the creep behavior of this lead-free solder Sn96.5Ag3Cu0.5 revealed the temperature sensitivity. Creep resistance of Sn96.5Ag3Cu0.5 revealed that the lead-free solder alloy Sn96.5Ag3Cu0.5 had some attractive mechanical properties.
Keywords :
copper alloys; creep testing; deformation; silver alloys; solders; stress analysis; tin alloys; Sn63Pb37; Sn96.5Ag3Cu0.5; constant stress level; creep behavior; creep property; creep resistance; creep test; deformation resistance; lead-free solder alloy; mechanical property; temperature 125 C; temperature 25 C; temperature environment; temperature sensitivity; Creep; Electronics packaging; Lead; Microelectronics; Packaging;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582445
