DocumentCode :
2274797
Title :
Phosphorous transient enhanced diffusion suppression with cluster carbon co-implantation at low temperature
Author :
Nakashima, Yoshiki ; Hamamoto, Nariaki ; Nagayama, Tsutomu ; Koga, Yuji ; Umisedo, Sei ; Hashimoto, Masahiro ; Onoda, Hiroshi
Author_Institution :
Nissin Ion Equip. Co., Ltd., Kyoto, Japan
fYear :
2012
fDate :
14-15 May 2012
Firstpage :
109
Lastpage :
112
Abstract :
Low temperature cluster carbon co-implantation was applied for phosphorous activation enhancement and transient enhanced diffusion (TED) suppression. The dependence of phosphorous activation and TED on 1) carbon energy, 2) dose and 3) substrate temperature have been investigated. 1) Implanted carbon depth compared with phosphorous depth was optimized for better phosphorous TED suppression and phosphorous activation. 2) Junction depth and sheet resistance (Rs) were evaluated as a function of carbon dose. 3) Amorphous layer thickness was controlled by cooling down the substrate temperature and the influence on TED and activation was evaluated. Finally shallow junction with low Rs has been achieved using low temperature cluster carbon co-implantation.
Keywords :
diffusion; ion implantation; phosphorus; amorphous layer thickness; carbon dose; carbon energy; implanted carbon depth; junction depth; low temperature cluster carbon co-implantation; phosphorous TED suppression; phosphorous activation enhancement; phosphorous depth; phosphorous transient enhanced diffusion suppression; sheet resistance; substrate temperature; Annealing; Carbon; Junctions; Resistance; Silicon; Substrates; Temperature dependence;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology (IWJT), 2012 12th International Workshop on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4673-1258-5
Electronic_ISBN :
978-1-4673-1256-1
Type :
conf
DOI :
10.1109/IWJT.2012.6212821
Filename :
6212821
Link To Document :
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