DocumentCode
2274946
Title
Implantation-induced structural defects in highly activated USJs: Boron precipitation and trapping in pre-amorphised silicon
Author
Cristiano, F. ; Essa, Z. ; Qiu, Y. ; Spiegel, Y. ; Torregrosa, F. ; Duchaine, J. ; Boulenc, P. ; Tavernier, C. ; Cojocaru, O. ; Blavette, D. ; Mangelinck, D. ; Fazzini, P.F. ; Quillec, M. ; Bazizi, M. ; Hackenberg, M. ; Boninelli, S.
Author_Institution
LAAS, Univ. of Toulouse, Toulouse, France
fYear
2012
fDate
14-15 May 2012
Firstpage
131
Lastpage
137
Abstract
Today, most of the state-of-the-art USJs fabrication processes involve the formation of an amorphous surface layer before or during the dopant implant step. In this paper, we present a review of some recent experimental studies on the Boron precipitation and trapping in pre-amorphised USJs. These studies suggest that the physical mechanism governing the Boron trapping mainly depends on the Boron concentration left below the a/c interface after the implant. In addition to providing a contribution to the understanding of the Boron trapping phenomenon, these results clearly indicate that physical models for the formation of large Boron precipitates need to be implemented in TCAD simulators for a comprehensive description of the USJ fabrication process.
Keywords
boron; crystal defects; doping profiles; elemental semiconductors; germanium; ion implantation; p-n junctions; precipitation; semiconductor doping; Ge:B; doping concentration; implantation-induced structural defects; preamorphised ighly activated ultrashallow source-drain junctions; precipitation; trapping; Abstracts; Annealing;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology (IWJT), 2012 12th International Workshop on
Conference_Location
Shanghai
Print_ISBN
978-1-4673-1258-5
Electronic_ISBN
978-1-4673-1256-1
Type
conf
DOI
10.1109/IWJT.2012.6212827
Filename
6212827
Link To Document