• DocumentCode
    2274946
  • Title

    Implantation-induced structural defects in highly activated USJs: Boron precipitation and trapping in pre-amorphised silicon

  • Author

    Cristiano, F. ; Essa, Z. ; Qiu, Y. ; Spiegel, Y. ; Torregrosa, F. ; Duchaine, J. ; Boulenc, P. ; Tavernier, C. ; Cojocaru, O. ; Blavette, D. ; Mangelinck, D. ; Fazzini, P.F. ; Quillec, M. ; Bazizi, M. ; Hackenberg, M. ; Boninelli, S.

  • Author_Institution
    LAAS, Univ. of Toulouse, Toulouse, France
  • fYear
    2012
  • fDate
    14-15 May 2012
  • Firstpage
    131
  • Lastpage
    137
  • Abstract
    Today, most of the state-of-the-art USJs fabrication processes involve the formation of an amorphous surface layer before or during the dopant implant step. In this paper, we present a review of some recent experimental studies on the Boron precipitation and trapping in pre-amorphised USJs. These studies suggest that the physical mechanism governing the Boron trapping mainly depends on the Boron concentration left below the a/c interface after the implant. In addition to providing a contribution to the understanding of the Boron trapping phenomenon, these results clearly indicate that physical models for the formation of large Boron precipitates need to be implemented in TCAD simulators for a comprehensive description of the USJ fabrication process.
  • Keywords
    boron; crystal defects; doping profiles; elemental semiconductors; germanium; ion implantation; p-n junctions; precipitation; semiconductor doping; Ge:B; doping concentration; implantation-induced structural defects; preamorphised ighly activated ultrashallow source-drain junctions; precipitation; trapping; Abstracts; Annealing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2012 12th International Workshop on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4673-1258-5
  • Electronic_ISBN
    978-1-4673-1256-1
  • Type

    conf

  • DOI
    10.1109/IWJT.2012.6212827
  • Filename
    6212827