Orientation relationships among Sn/Cu6Sn5/Cu3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint

Author

Shang, Pan-Ju ; Liu, Zhi-Quan ; Li, Douxing ; Shang, Jian-Ku

Author_Institution

Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang, China

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

165

Lastpage

169

Abstract

TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring phases: Cu(111)/Cu₆Sn₅, Cu(111)/Cu₃Sn, Cu₃Sn/Cu₆Sn₅, Cu₆Sn₅/Sn. The precise SAED analysis revealed during nucleation and growth process of interfacial IMCs the neighboring phases kept perfect orientation relationships in order to decrease the nucleation driving force of IMCs.

Keywords

bismuth alloys; copper; copper alloys; electron diffraction; eutectic alloys; nucleation; reflow soldering; solders; tin; tin alloys; transmission electron microscopy; Cu; Cu(111) substrate; SAED; Sn-CuSn-Cu; SnBi-Cu; TEM; eutectic solder joint; growth process; interfacial intermetallic compounds; neighboring phases; nucleation process; orientation relationship; reflowing; selected area electron diffraction; solder-substrate interface; transmission electron microscope; Copper; Crystals; Equations; Microstructure; Substrates; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582454

Filename

5582454