• DocumentCode
    2275215
  • Title

    Investigation of band structure at metal-gate/high-k interface of metal oxide semiconductor device with high-k and metal gate stack

  • Author

    Xiaolei Wang ; Wenwu Wang ; Kai Han ; Hong Yang ; Jing Zhang ; Xueli Ma ; Jinjuan Xiang ; Chao Zhao ; Dapeng Chen ; Tianchun Ye

  • Author_Institution
    Key Lab. of Microelectron. Devices & Integrated Technol., Inst. of Microelectron., Beijing, China
  • fYear
    2012
  • fDate
    14-15 May 2012
  • Firstpage
    176
  • Lastpage
    179
  • Abstract
    Band alignment of TiN/HfO2 interface of TiN/HfO2/SiO2/Si stack is investigated by x-ray photoelectron spectroscopy (XPS). The p-type Schottky barrier height (p-SBH) is found to increase with thicker HfO2 thickness. Since considering only the metal/dielectric interface cannot explain this phenomenon, band alignment of TiN/HfO2 interface of TiN/HfO2/SiO2/Si stack is demonstrated based on band alignment of entire gate stack. Dependence of p-SBH on HfO2 thickness is interpreted and contributed to fixed charges in gate stack, interfacial gap state charges at HfO2/SiO2 interface, and space charges in Si substrate. Electrical measurements of capacitor structures further support XPS results and corresponding explanation.
  • Keywords
    Schottky barriers; band structure; elemental semiconductors; hafnium compounds; high-k dielectric thin films; silicon compounds; titanium compounds; HfO2 thickness; Si substrate; TiN-HfO2; TiN-HfO2-SiO2-Si; X-ray photoelectron spectroscopy; XPS; band alignment; band structure; capacitor structure; electrical measurement; gate stack; interfacial gap state; metal oxide semiconductor device; metal-gate-high-k interface; p-SBH; p-type Schottky barrier height; space charges; Dielectrics; Hafnium compounds; High K dielectric materials; Logic gates; Silicon; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2012 12th International Workshop on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4673-1258-5
  • Electronic_ISBN
    978-1-4673-1256-1
  • Type

    conf

  • DOI
    10.1109/IWJT.2012.6212837
  • Filename
    6212837