DocumentCode
2275319
Title
Composite effects of reflections and ground bounce for signal vias in multi-layer environment
Author
Lin, Sheng-Mou ; Wu, Ruey-Beei
Author_Institution
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Volume
3
fYear
2001
fDate
2001
Firstpage
1127
Abstract
The signal propagating down the vias in a multi-layer environment will suffer from composite effects of reflected noise by via discontinuity and ground bounce between power/ground planes. An equivalent circuit modeling is proposed to simulate these effects, which consists of transmission line for signal line, lumped inductance and capacitance for via discontinuity, and two-dimensional field solver for the region between the power and ground planes. Simulations are performed for a four-layer structure and three different cases are considered to characterize both effects. Results show that the via discontinuity is dominant for reflected noise in the early time response, while the ground bounce is dominant in the late time response
Keywords
circuit noise; digital circuits; electromagnetic compatibility; equivalent circuits; finite difference time-domain analysis; packaging; printed circuits; 2D field solver; PCB; composite effects; equivalent circuit modeling; four-layer structure; ground bounce; lumped capacitance; lumped inductance; multi-layer environment; packaging structure; power/ground planes; printed circuit boards; reflected noise; signal reflection; signal vias; transmission line; two-dimensional field solver; via discontinuity; Acoustic reflection; Circuit noise; Circuit simulation; Distributed parameter circuits; Equivalent circuits; Inductance; Power transmission lines; Time factors; Transmission line discontinuities; Working environment noise;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2001. APMC 2001. 2001 Asia-Pacific
Conference_Location
Taipei
Print_ISBN
0-7803-7138-0
Type
conf
DOI
10.1109/APMC.2001.985330
Filename
985330
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