• DocumentCode
    227556
  • Title

    Electron energy distribution function of capacitive coupled electronegative plasma: The role of flow rate of electronegative gas in Ar

  • Author

    Xin, Y. ; Hong, B.S. ; Xu, D.S. ; Yu, Y.Q.

  • Author_Institution
    Sch. of Phys. Sci. & Technol., Soochow Univ., Suzhou, China
  • fYear
    2014
  • fDate
    25-29 May 2014
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The advantages of negative-ion assisted etching and charge -free ion implantation in semiconductor manufacturing has prompted investigations into electronegative plasmas. We have presented here the measurement results of 40.68 MHz-driven capacitively coupled Ar plasma mixed with electronegative gas by using Langmuir electrostatic probe. Three kinds of electronegative gases (O2, Cl2 and SF6) into Ar plasma were considered. We found that the electron energy distribution of Ar plasma exhibits a typical bi-Maxwellian distribution at the low pressure of 2.0 Pa like other author´s re port. As adding electronegative gas into Ar plasma, there appeared a high-energy peak in the electron energy distribution function (EEDF). While the flow rate of the electronegative gas into Ar plasma was increased, the high-energy peak in EEDF shifted toward a higher energy due to bulk heating, meanwhile, the electron density reduced significantly, especially for the strong electro-negative SF6/Ar plasma, the electron temperature increased. The negative ion characteristics are closely related to the changes in the EEDF, electron temperature and density. We calculated the electronegativity of Ar plasmas with three kinds of electro-negative gases. In general, comparison of these characteristics for different electronegative gases provides useful information for deeper understanding of electronegative plasmas.
  • Keywords
    Langmuir probes; argon; chlorine; electronegativity; etching; oxygen; plasma density; plasma flow; plasma heating; plasma temperature; sulphur compounds; Ar-Cl2; Ar-O2; Ar-SF6; Langmuir electrostatic probe; argon; biMaxwellian distribution; bulk heating; capacitive coupled electronegative plasma; charge-free ion implantation; electron density; electron energy distribution function; electron temperature; electronegative SF6-argon plasma; electronegative gas; flow rate; frequency 40.68 MHz; low-pressure effects; negative-ion assisted etching; pressure 2.0 Pa; semiconductor manufacturing; Distribution functions; Educational institutions; Gases; Plasma temperature; Sulfur hexafluoride; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Sciences (ICOPS) held with 2014 IEEE International Conference on High-Power Particle Beams (BEAMS), 2014 IEEE 41st International Conference on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4799-2711-1
  • Type

    conf

  • DOI
    10.1109/PLASMA.2014.7012422
  • Filename
    7012422