DocumentCode
2275830
Title
MSC-clustering and forward stepwise regression for virtual metrology in highly correlated input spaces
Author
Prakash, PKS ; Schirru, Andrea ; Hung, Peter ; McLoone, Seán
Author_Institution
Nat. Univ. of Ireland, Maynooth, Ireland
fYear
2012
fDate
15-17 May 2012
Firstpage
45
Lastpage
50
Abstract
Increasingly semiconductor manufacturers are exploring opportunities for virtual metrology (VM) enabled process monitoring and control as a means of reducing non-value added metrology and achieving ever more demanding wafer fabrication tolerances. However, developing robust, reliable and interpretable VM models can be very challenging due to the highly correlated input space often associated with the underpinning data sets. A particularly pertinent example is etch rate prediction of plasma etch processes from multichannel optical emission spectroscopy data. This paper proposes a novel input-clustering based forward stepwise regression methodology for VM model building in such highly correlated input spaces. Max Separation Clustering (MSC) is employed as a pre-processing step to identify a reduced srt of well-conditioned, representative variables that can then be used as inputs to state-of-the-art model building techniques such as Forward Selection Regression (FSR), Ridge regression, LASSO and Forward Selection Ridge Regression (FCRR). The methodology is validated on a benchmark semiconductor plasma etch dataset and the results obtained are compared with those achieved when the state-of-art approaches are applied directly to the data without the MSC pre-processing step. Significant performance improvements are observed when MSC is combined with FSR (13%) and FSRR (8.5%), but not with Ridge Regression (-1%) or LASSO (-32%). The optimal VM results are obtained using the MSC-FSR and MSC-FSRR generated models.
Keywords
electronic engineering computing; regression analysis; semiconductor industry; virtual instrumentation; LASSO; MSC-clustering; forward selection regression; forward selection ridge regression; forward stepwise regression; highly correlated input spaces; max separation clustering; nonvalue added metrology; process control; process monitoring; semiconductor manufacturers; virtual metrology; wafer fabrication tolerance; Buildings; Metrology; Plasmas; Process control; Semiconductor device modeling; Spectroscopy; Stimulated emission; Virtual metrology; clustering; optical emission spectroscopy; plasma etch processes; regression;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
Conference_Location
Saratoga Springs, NY
ISSN
1078-8743
Print_ISBN
978-1-4673-0350-7
Type
conf
DOI
10.1109/ASMC.2012.6212866
Filename
6212866
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