DocumentCode
2276343
Title
A predictive maintenance system based on regularization methods for ion-implantation
Author
Susto, Gian Antonio ; Schirru, Andrea ; Pampuri, Simone ; Beghi, Alessandro
Author_Institution
Dept. of Inf. Eng., Univ. of Padova, Padova, Italy
fYear
2012
fDate
15-17 May 2012
Firstpage
175
Lastpage
180
Abstract
Ion Implantation is one of the most sensitive processes in Semiconductor Manufacturing. It consists in impacting accelerated ions with a material substrate and is performed by an Implanter tool. The major maintenance issue of such tool concerns the breaking of the tungsten filament contained within the ion source of the tool. This kind of fault can happen on a weekly basis, and the associated maintenance operations can last up to 3 hours. It is important to optimize the maintenance activities by synchronizing the Filament change operations with other minor maintenance interventions. In this paper, a Predictive Maintenance (PdM) system is proposed to tackle such issue; the filament lifetime is estimated on a statistical basis exploiting the knowledge of physical variables acting on the process. Given the high-dimensionality of the data, the statistical modeling has been based on Regularization Methods: Lasso, Ridge Regression and Elastic Nets. The predictive performances of the aforementioned regularization methods and of the proposed PdM module have been tested on actual productive semiconductor data.
Keywords
ion implantation; maintenance engineering; regression analysis; semiconductor device manufacture; Lasso methods; PdM system; elastic nets methods; filament change operations; ion implantation; predictive maintenance system; regularization methods; ridge regression methods; semiconductor manufacturing; Accuracy; Ion implantation; Kernel; Manufacturing; Predictive maintenance; Predictive models;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
Conference_Location
Saratoga Springs, NY
ISSN
1078-8743
Print_ISBN
978-1-4673-0350-7
Type
conf
DOI
10.1109/ASMC.2012.6212884
Filename
6212884
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