Thermal management of silicon carbide power module for military hybrid vehicles

Author

Gould, Kyle ; Cai, Steve Q. ; Neft, Charles ; Bhunia, Avijit

Author_Institution

Teledyne Sci. & Imaging, LLC, Thousand Oaks, CA, USA

fYear

2014

fDate

9-13 March 2014

Firstpage

105

Lastpage

108

Abstract

De-rating of power electronics is a common practice in harsh environment operating conditions. Advanced cooling solutions are needed to overcome the thermal limitations and prevent the de-rating of power components. This study investigates a silicon carbide power module for 28 V DC to 300 V DC power conversion (or reverse) in military hybrid vehicle applications. A combined experimental and numerical modeling effort is reported, to accurately predict the silicon carbide switch (device) junction temperature. The results show that jet impingement cooling at the module base plate increases the module heat dissipation capability by 2.5X and 1.5X, compared to the commercial-off-the-shelf cold plate cooling and micro-channel cooling solutions respectively.

Keywords

cooling; hybrid electric vehicles; jets; military vehicles; power conversion; power electronics; silicon compounds; switches; thermal management (packaging); SiC; cooling solutions; harsh environment; jet impingement cooling; military hybrid vehicles; power component derating; power conversion; silicon carbide power module; silicon carbide switch junction temperature; thermal management; voltage 28 V to 300 V; Cold plates; Coolants; Heating; Junctions; Silicon carbide; Temperature measurement; Harsh environment; Jet impingement; Liquid cooling; Silicon carbide power electronics; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2014 30th Annual

Conference_Location

San Jose, CA

Type

conf

DOI

10.1109/SEMI-THERM.2014.6892224

Filename

6892224